Product Details

Small Size Polishing Machine

The tabletop and stand alone lapping machines are designed with the optimum equipment size to build a polishing process accommodating for lab scale to production scale. In particular, the adoption of a highly rigid body suitable for high-pressure polishing and a uniquely developed water-cooled spindle keeps the temperature of the polishing pad surface constant and achieves high-precision rotation with less vibration.

Machine Specification

MODEL :
EJW-460I-CMP

Model (EJW-xxx)	EJ-300-CMP	EJ-380-CMP	EJW-380I-CMP	EJW-460-CMP
Lapping Plate Siz (OD x IDmm)	300 x 100	380 x 140		460 x 180
Conditioning Ring Size (OD x IDmm)	143 x 108	178 x 140		220 x 182
Waxing Plate Size (ODmm)	107	138		180
Main Motor (kW)	0.4		1.5	2.2
Water-cooling
Number of Stations	3 Stations with Roller Arm		2 Stations with Motorized Drive
Power Supply	AC200V 3Phase 50/60Hz
Size (W x D x Hmm)	550 x 780 x 410		800 x 800 x 1,900	1,200 x 1,300 x 1,900
Weight (Kg NET)	95		800	1,000

* EJ-300/380-CMP is a desktop type.

Large Size Polishing Machine

In particular, we have a full line-up of high-precision large-scale lapping machines of various sizes to meet the high-quality polishing required by the increasing diameter of semiconductor wafers. The processing chamber inside the full cover is excellent in safety, preventing dust from outside and achieving high-quality surface roughness.

Machine Specification

MODEL :
EJD-910I-ALD

Model (EJW-xxx)	610	710	910	1200
Lapping Plate Size (OD x IDmm)	610 x 210	710 x 210	910 x 300	1,200 x 400
Conditioning Ring Size (OD x IDmm)	286 x 250	360 x 322	435 x 385	500 x 452
Waxing Plate Size (ODmm)	248	320	383	450
Main Motor (kW)	3.7	5.5	7.5	22
Water-cooling
Number of Stations	3 Stations with Roller Arm
Power Supply	AC200V 3Phase 50/60Hz
Size (W x D x Hmm)	1,200 x 1,300 x 1,900	1,200 x 1,600 x 1,900	2,000 x 1,600 x 2,000	2,200 x 2,000 x 2,300
Weight (Kg NET)	1,300	1,500	3,000	4,000

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