Product Details
Polishing Pad
The production of rigorous surface finishes on silicon or other semiconductor crystals is becoming increasingly demanding, making it very important to meet the requirements of today's semiconductor industry.
Engis offers a variety of polishing pad types according to customer requirements.
For the features and specifications of each pad, select the most suitable pad from the table below according to various materials and polishing conditions. The adhesive is attached to the back of the pad, so it is extremely easy to install on the polishing surface.
Specification
Code | DMP PAD | CMP PAD | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
R10 | F66 | 9450 | 410 | 9415 | 437 | 4FV4 | 432 | 434 | 530N | 540N | ||
PAD TYPE | Woven Fabric | |||||||||||
Flocked | ||||||||||||
Compressed Nap | ||||||||||||
Non Woven | ||||||||||||
Suede | ||||||||||||
w/synthetic support | ||||||||||||
Suitable Diamond Size (um) |
1/10 | |||||||||||
1/4 | ||||||||||||
1/2 | ||||||||||||
1 | ||||||||||||
3 | ||||||||||||
6 | ||||||||||||
9 | ||||||||||||
15 | ||||||||||||
Other Slurries | Alumina | |||||||||||
Cerium Oxide | ||||||||||||
Silica |
* Standard Size (ODmm) 150/200/300/380/610/710/910 (Please ask for other sizes)
* 9450 and 437 are oil proof
Woven Fabric
Non Woven
Suede
Flocked
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