Product Details

Polishing Pad

The production of rigorous surface finishes on silicon or other semiconductor crystals is becoming increasingly demanding, making it very important to meet the requirements of today's semiconductor industry.
Engis offers a variety of polishing pad types according to customer requirements.
For the features and specifications of each pad, select the most suitable pad from the table below according to various materials and polishing conditions. The adhesive is attached to the back of the pad, so it is extremely easy to install on the polishing surface.

Specification

Code DMP PAD CMP PAD
R10 F66 9450 410 9415 437 4FV4 432 434 530N 540N
PAD TYPE Woven Fabric
Flocked
Compressed Nap
Non Woven
Suede
w/synthetic support
Suitable Diamond
Size (um)
1/10
1/4
1/2
1
3
6
9
15
Other Slurries Alumina
Cerium Oxide
Silica

* Standard Size (ODmm) 150/200/300/380/610/710/910 (Please ask for other sizes)
* 9450 and 437 are oil proof

Woven Fabric

Non Woven

Suede

Flocked