Product Details
Wafer Bonding Machine
EBM-250HCD is a equipment designed and developed for bonding wafers and waxing plates (ceramic plates). Solid wax is made into liquid form and a certain amount of wax is supplied by a dispenser according to the wafer size.
In addition, pressurization, heating, and cooling are performed on the same table to control the variation in wafer thickness, flatness, and parallelism due to adhesion.
Machine Specification
MODEL : EBM-200HCD
| Pressure Plate Material | SUS (⌀250mm) |
| Wafer Size | Max. ⌀248mm |
| Wafer Allocation | Manual |
| Pneumatic Equipment | Pneumatic Cylinder φ100mm / Stroke 250mmL |
| Heating Method | Heating Coil Max. 150degC |
| Wax Dispenser | Heating Coil Tank Max. 150degC |
| Cooling Method | External Chiller Unit |
| Shutter Opening & Closing | Pneumatic Cylinder with Select SW |
| System Status | Signal Tower Light (3 colors with Buzzer) |
| Power Supply | AC200V 3Phase 50/60Hz |
| Dimension (W x D x H mm) | 780 x 750 x 1,870 |
| Weight (Kg NET) | 400 |
Standard Bonding Machine
The HWB series of bonding devices is a simple bonding device used in a wide range of fields.
The cooling table is equipped with a water jacket, which can be connected with a cooling circulation chiller to efficiently cool the waxing plate.
The adhesive pressure is pressed against the synchronized flat plate with a pressurized cylinder to suppress unevenness of wax and apply with good adhesion.
Machine Specification
MODEL : HWB-36
| MODEL | HWB-12 | HWB-15 | HWB-18 | HWB-24 | HWB-36 |
|---|---|---|---|---|---|
| WAXING PLATE OD (mm) | ⌀107 mm | ⌀138 mm | ⌀180 mm | ⌀248 mm | ⌀383 mm |
| No. of Stations | 1 - 4 | 1 - 2 | 1 | ||
| Option1 - Hot Plate | EC-1200NP |
|---|---|
| Plate Size | 400 mm x 300 mm |
| Maximum Temp. | 300degC |
| Power Supply | AC100V 900W |
| Option2 - Chiller | HRS-050-A-20-B |
| Temperature Range | 5~40±0.1degC |
| Maximum Flow | 50Hz 29L/min, 60Hz 38L/min |
| Power Supply | AC200V 550W |
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