Product Details
CMP Slurry
CMP (Chemical Mechanical Polishing) slurry is designed to remove work piece surface mechanically with chemical etching reaction. We have a variety of CMP slurries to suit the property of the material.
Specification
| CMP Slurry | HCL-20 | HCL-XL | TECS-60J | PA2004 | |
|---|---|---|---|---|---|
| Silica Size | 20nm | ||||
| 40nm | |||||
| 60nm | |||||
| Alumina Size | 200 ～ 400nm | ||||
* PA2004 is designed to perform polishing SiC wafer
Polishing Compounds
This polishing compound is made by concentrating alumina, silica and cerium, which are the main abrasive grains for polishing, in colloidal form.
Specification
Colloidal Alumina (White) Metal Polishing
Colloidal Silica (Blue) Metal/Optical Parts Polishing
Colloidal Cerium Oxide (Beige) Optical Parts Polishing
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