Product Details
Double Sided Lapping Machine
The EJD series is a double-sided polishing machine that supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover can also be used in a semiconductor manufacturing environment. In addition, a wide variety of optional functions are available, such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen, which are indispensable for simultaneous double-sided polishing of thin wafers.
Machine Specification
MODEL : EJD-6BY
MODEL : EJD-9BL
| Model (EJD-xxx) | 6B | 9B | 12B | 16B |
|---|---|---|---|---|
| Lapping Plate Size (OD x IDmm) | 386 | 635 | 762 | 1,127 |
| Carrier (Gear Type / ODmm) | DP12 / 143.7 | DP12 / 232.7 | DP12 / 287.8 | DP12 / 427.5 |
| Lower Plate Speed (rpm) | 10~60 | 10~40 | ||
| Main Motor (kW) | 2.2 | 3.7 | 7.5 | |
| Driving Way | 4way | |||
| Power Supply | AC200V 3Phase 50/60Hz | |||
| Size (W x D x Hmm) | 800 x 800 x 1,900 | 1,500 x 1,200 x 2,300 | 1,850 x 1,400 x 2,600 | 1,990 x 1,400 x 3,100 |
| Weight (Kg NET) | 800 | 2,000 | 2,800 | 3,500 |
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