Product Details

Double Sided Lapping Machine

The EJD series is a double-sided polishing machine that supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover can also be used in a semiconductor manufacturing environment. In addition, a wide variety of optional functions are available, such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen, which are indispensable for simultaneous double-sided polishing of thin wafers.

Machine Specification



Model (EJD-xxx) 6B 9B 12B 16B
Lapping Plate Size (OD x IDmm) 3866357621,127
Carrier (Gear Type / ODmm) DP12 / 143.7DP12 / 232.7DP12 / 287.8DP12 / 427.5
Lower Plate Speed (rpm) 10~6010~40
Main Motor (kW)
Driving Way4way
Power SupplyAC200V 3Phase 50/60Hz
Size (W x D x Hmm) 800 x 800 x 1,9001,500 x 1,200 x 2,3001,850 x 1,400 x 2,6001,990 x 1,400 x 3,100
Weight (Kg NET) 8002,0002,8003,500