Product Details
Diamond Compound
There are three types of hand-polishing compound Hyprez Diamond Paste W / OS / L types depending on the application.
W-type Diamond Compound (Paste)
- ・A water-soluble paste that can be easily cleaned after polishing.
- ・Suitable for difficult jobs with oil-based compounds.
- ・When adding lubricating oil, use W type lubricant.
OS-type Diamond Compound
- ・It is an oil-based paste.
- ・Oil-based lubrication enhances efficient cutting during polishing.
- ・Contains more lubricant and has a self-lubricating effect.
- ・When adding lubricating oil, use OS type lubricant.
L-type Diamond Compound
- ・Suitable for drawing dies and heading dies.
- ・The wire drawing carbide dies and heading dies require high concentration diamond compound. It is important to supply lubrication oil depending on the cutting cycle, appropriate polishing points.
- ・It is also used for flat lapping with higher stock removal such as carbide tools and mechanical seals.
Specification
| Compound Type | Mesh Size (#) | ||
|---|---|---|---|
| W (Water Base) | OS (Oil Base) | L | |
| 0.1µ-W-475 | 0.1µ-OS-475 | 0.1-L | 240,000 |
| 0.25µ-W-475 | 0.25µ-OS-475 | 0.25-L | 100,000 |
| 0.5µ-W-475 | 0.5µ-OS-475 | 0.5-L | 60,000 |
| 1µ-W-47 | 1µ-OS-47 | 1-L | 14,000 |
| 3µ-W-40 | 3µ-OS-40 | 3-L | 8,000 |
| 6µ-W-375 | 6µ-OS-375 | 6-L | 3,000 |
| 9µ-W-35 | 9µ-OS-35 | 9-L | 1,800 |
| 15µ-W-35 | 15µ-OS-35 | 15-L | 1,200 |
| 30µ-W-30 | 30µ-OS-30 | 30-L | 600 |
| 45µ-W-30 | 45µ-OS-30 | 45-L | 325 |
| 60µ-W-30 | 60µ-OS-30 | 60-L | 270 |
| #230-W-30 | #230-OS-30 | 230-L | 230 |
| #170-W-30 | #170-OS-30 | 170-L | 170 |
| #100-W-30 | #100-OS-30 | 100-L | 100 |
* The table above are pastes with standard diamond concentration
* Medium and strong diamond concentrations are available upon request
Diamond Gel
Gel type diamond compound. It is less viscosity than diamond compound paste type and does not need to be dissolved with lubricating oil. In particular, the gel effect makes it easy to hold on to polishing brushes and bobs, and the gel-wrapped diamond abrasive demonstrate high polishing performance.
Specification
| Micron Size (µm) | Mono Crystal / Poly Crystal | Water Base / Oil Base | Mesh Size (#) |
|---|---|---|---|
| 1/4 | MA / PC | GW / GO | 100,000 |
| 1/2 | 60,000 | ||
| 1 | 14,000 | ||
| 2 | 11,000 | ||
| 3 | 8,000 | ||
| 6 | 3,000 | ||
| 9 | 1,800 | ||
| 15 | MA | 1,200 | |
| 30 | 600 | ||
| 45 | 325 |
Diamond Compound
(Liquid Type)
A concentrated slurry formulated for mold polishing that requires large amounts of stock removal.
Despite the high diamond concentration, the abrasive grains are excellent in dispersibility and the amount of abrasive grains supplied to the polishing surface of the mold is always stable, so polishing accuracy can be maintained at a constant level.
Specification
| Liquid Code | Mesh Size |
|---|---|
| 1/10-C4418 | 240,000 |
| 1/4-C4418 | 100,000 |
| 1/2-C4418 | 60,000 |
| 1-C4418 | 14,000 |
| 2-C4418 | 11,000 |
| 3-C4418 | 8,000 |
| 6-C4418 | 3,000 |
| 9-C4418 | 1,800 |
| 15-C4418 | 1,200 |
| 30-C4418 | 600 |
| 45-C4418 | 325 |
Lubricant
A lubricating oil that maximizes the polishing performance of diamond abrasive. There is a variety of lineups customized for using diamond slurries or compound.
Specification
W Type (Water Base) This type is a lubricating oil suitable for diamond paste W type. It has a thick oil film and suitable for polishing.
S-4889 Type (Water Base) This type is a lubricating oil developed especially for use together with the diamond slurry S-4889 type, and has an extremely thin oil film and excellent cutting performance.
OS Type (Oil Base) This type is a lubricating oil developed for use with oil-based diamond slurry and diamond paste.
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