Product Details
Large Size Lapping Machine
We have a full line-up of high-precision large-scale lapping machines of various sizes to meet the high-precision lapping required by the mass production of high-value-added parts and the increasing diameter of semiconductor wafers. In addition to the standard facing mechanism, the GNC series, in which the Z-axis is controlled by a servo motor, enables highly accurate flattening of the lapping plate by correcting the straightness of the facing slider and reprocessing of the spiral groove.
Machine Specification
MODEL :
EJW-610INF-3ALD
MODEL :
EJW-910IF-ALD
| Model (EJW-xxx) | 610 | 710 | 910 | 1200 |
|---|---|---|---|---|
| Lapping Plate Size (OD x IDmm) | 610 x 210 | 710 x 210 | 910 x 300 | 1,200 x 400 |
| Conditioning Ring Size (OD x IDmm) | 286 x 250 | 360 x 322 | 435 x 385 | 500 x 452 |
| Waxing Plate Size (ODmm) | 248 | 320 | 383 | 450 |
| Water-cooling | ||||
| Facing Device | ||||
| Main Motor (kW) | 3.7 | 5.5 | 7.5 | 22 |
| Number of Stations | 3 Stations Roller Arm | |||
| Power Supply | AC200V 3Phase 50/60Hz | |||
| Size (W x D x Hmm) | 1,200 x 1,300 x 1,900 | 1,200 x 1,600 x 1,900 | 2,000 x 1,600 x 2,000 | 2,200 x 2,000 x 2,300 |
| Weight (Kg NET) | 1,300 | 1,500 | 3,000 | 4,000 |
* Size is not including optional facing device
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