Product Details

Large Size Lapping Machine

We have a full line-up of high-precision large-scale lapping machines of various sizes to meet the high-precision lapping required by the mass production of high-value-added parts and the increasing diameter of semiconductor wafers. In addition to the standard facing mechanism, the GNC series, in which the Z-axis is controlled by a servo motor, enables highly accurate flattening of the lapping plate by correcting the straightness of the facing slider and reprocessing of the spiral groove.

Machine Specification



Model (EJW-xxx) 610 710 910 1200
Lapping Plate Size
(OD x IDmm)
610 x 210710 x 210910 x 3001,200 x 400
Conditioning Ring Size
(OD x IDmm)
286 x 250360 x 322435 x 385500 x 452
Waxing Plate Size (ODmm) 248320383450
Facing Device
Main Motor (kW)
Number of Stations3 Stations Roller Arm
Power SupplyAC200V 3Phase 50/60Hz
Size (W x D x Hmm) 1,200 x 1,300 x 1,9001,200 x 1,600 x 1,9002,000 x 1,600 x 2,0002,200 x 2,000 x 2,300
Weight (Kg NET) 1,3001,5003,0004,000

* Size is not including optional facing device