Product Details

Tabletop / Standalone Lapping Machine

The tabletop and stand alone lapping machines are designed with the optimum equipment size to build a polishing process accommodating for lab scale to production scale. In particular, the adoption of a highly rigid body suitable for diamond lapping and a uniquely developed water-cooled spindle keeps the surface temperature of the lapping machine constant and achieves high rotational accuracy with less vibration. In addition, by installing a high-precision facing device, the stable surface plate flatness is maintained at all times to achieve ultra-precision lapping.

Machine Specification



Model EJ-200 EJ-300 EJ-380 EJW-400 EJW-460
Lapping Plate Size
(OD x IDmm)
200 x 40300 x 100380 x 140460 x 180
Conditioning Ring Size
(OD x IDmm)
98 x 79143 x 108178 x 140220 x 182
Waxing Plate Size (ODmm) 76107138180
Main Motor (kW)
Facing Device (optional)
Number of Stations1 Station3 Stations
Power SupplyAC100V
Single Phase
AC200V 3Phase 50/60Hz
Size (W x D x Hmm) 360 x 640 x 590550 x 780 x 410700 x 1,540 x 1,0001,200 x 1,300 x 1,500
Weight (Kg NET) 28958501,000

* Size is not including optional facing device